EINDHOVEN, The Netherlands, November 1, 2018 — At the Vision 2018 trade fair, Stuttgart, Germany, November 6th-8th, 2018, Adimec (www.adimec.com), a world leader in application-specific industrial camera solutions, will reveal the specifications of the S-65A35 camera created for the future of PCB inspection.
A product demonstrator of this camera with Gpixel sensor will be shown at the GPixel booth 1J32. This, ultra high-resolution, high frame rate, camera has superior sensor characteristics, delivering greater efficiencies and exactness in machine vision applications. The 65-megapixel resolution, CMOS, global shutter camera captures rectangular images of 9344×7000 pixels at 35 frames per second using the CoaXPress interface. This camera is the next leap in throughput and accuracy for real time metrology and inspection applications.
With the feature size of both semiconductor lithography and PCB component defects getting smaller the need for increased resolution in inspection cameras becomes crucial. The S-65A35 supports the detail required for smaller technology nodes as well as increased resolution for next generation PCB inspection. With 3.2 micron pixels the S-65A35 puts more pixels per unit area and thus per unit field of view yielding dramatic improvements in resolution, accuracy and precision. In addition, the noise level is significantly reduced, and the quantum efficiency is improved over the existing solutions providing for increased sensitivity and a dynamic range of 70 dB.
Sample availability for the S-65A35 camera is planned for mid-2019.
The S-65A35 presents exceptionally high full well capacity of 12.5 Ke-, along with excellent read noise (2 e-) and low dark current. The image sensor and camera together offer high image quality with optimizations available via camera functionality such as defect pixel corrections and uniformity corrections.
The camera will be upheld to the exacting standards of Adimec cameras providing repeatable image performance camera-to-camera for tool matching and consistent product reliability for best cost of ownership. Camera-to-camera consistency and reliability are supremely important. Along with thorough quality control, a critical aspect of repeatability is precise image sensor mounting and alignment to the optics reducing the mechanical and optical alignment time during customer’s manufacturing of their systems. The S-65A35 is also designed to support high mean time between failures (MTBF) for 24/7 operations through advanced thermal mitigation design concepts. The cost of development and system impact is minimized when moving from the Adimec S-25 to the S-65A35, as it has been designed for easy change over to support tool requirements to reduce testing costs and sustained productivity.
We invite you to meet the Adimec engineers to discuss vision optimization requirements at Vision 2018 in Stuttgart, Germany at the Adimec booth #1G68.
Adimec Advanced Image Systems b.v.
Press Contact: E. Nugteren (firstname.lastname@example.org)