See more details with HD cameras regardless of fog or hazy conditions
At the SPIE Defense, Security, and Sensing 2012, Adimec demonstrated two technologies that are part of our rugged camera platform.
At the SPIE Defense, Security, and Sensing 2012, Adimec demonstrated two technologies that are part of our rugged camera platform.
There is an on-going evolution happening in the type of image sensor best suited for various applications, with two camps firmly established: CCD and CMOS. There is a lot of talk of the increased market share for CMOS sensors. We have dedicated several posts to this topic and the advantages and disadvantages of each technology…
While smartphones are affecting available image sensor technology, there are also advances in machine vision to support the production of smartphones.
Higher resolution cameras combined with high speeds allow for improvements in accuracy required by manufacturers of semiconductor wafer inspection and metrology equipment.
At the Vision Show in Boston 2012 last week, the predominant trends were a huge increase in CMOS cameras and a widespread adoption of CoaXPress.
Higher resolution cameras combined with high speeds allow for greater throughput and accuracy required by manufacturers of semiconductor packaging inspection equipment supporting smartphone production demand.
Higher resolution cameras combined with high speeds allow for move to 3D required by manufacturers of PCB inspection equipment.
There has been a lot of talk (us included) about the use of CMOS image sensors taking over CCD image sensors in machine vision. Recent data reported in the 2012 AIA Machine Vision Camera Study, shows that the opposite was true in 2011. We at Adimec still believe CMOS image sensors will gain significant adoption…
The trend in 2011 towards increased CCD image sensor use over CMOS, was contrary to what was expected. We believe this is just a slow adoption of new technology and not an indication of any long-term trends. Regardless of the differing available data we still believe that CMOS image sensors will be used significantly more in…
The changes in PCB manufacturing with smaller chips, different packages, higher density printed circuit board, and multi-layered, and more complex boards are resulting in the migration from 2D to 3D measurements. Here we provide more details on the machine vision camera requirements to enable this change.