High-speed image capturing combined with increase in accuracy for inspection and metrology is a challenge when trying to keep or increase production line throughput. Microchip Technology Inc. has made strides in achieving this goal with the introduction of CoaXpress technology on factory floors. With the new EQCO125X40 CoaXPress line, they have developed the first single chip physical layer interface device implementing CXP 2.0 standard with a maximum speed of 12.5 Gbps which includes features that will streamline machine vision design, maximize transmission speed and simplify deployment in high throughput inspection and imaging applications. More about CoaxPress 2.0.
The chip works across all frequencies at any speed, from CXP-1 to CXP-12, and supports 12.5 Gbps of bandwidth over a single cable covering a distance of 40 meters. This highspeed chipset with a low power consumption makes it ideal for compact, high throughput and robust image capture solutions. Adimec’s own Director of Marketing and Sales, Andre Jacobs, said “With Microchips CXP devices, we support our market needs for a doubling in data throughput while keeping the same system costs.”
Click Here to read more about Microchip Technology Inc. and their new EQCO125X40 line of CoaXPress Devices.