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CCD or CMOS? COTS or Custom? Discussions to Continue at SPIE DSS 2012
With the upcoming SPIE Defense, Security, and Sensing show, we’re reminded of several previous topics pertaining to defense imaging that…
Free e-Paper: How to get the best image for ALPR/ANPR
Since automatic license plate recognition (ALPR) or automatic number plate recognition (ANPR) relies on optical character recognition (OCR) of images,…
CCD vs. CMOS Image Sensors for Machine Vision, Global Security, and Traffic Applications
There is an on-going evolution happening in the type of image sensor best suited for various applications, with two camps…
See more details with HD cameras regardless of fog or hazy conditions
At the SPIE Defense, Security, and Sensing 2012, Adimec demonstrated two technologies that are part of our rugged camera platform.
Considerations with Board Level Camera Modules
When a board level seems to be the only solution to overcome space, size, and customization constraints, you have to…
High-resolution cameras combined with high speeds support latest smartphones production demand, part 2
Higher resolution cameras combined with high speeds allow for greater throughput and accuracy required by manufacturers of semiconductor packaging inspection…
CMOS and CoaXPress are in the Mainstream of Machine Vision as seen at the Vision Show Boston 2012
At the Vision Show in Boston 2012 last week, the predominant trends were a huge increase in CMOS cameras and…
High-resolution cameras combined with high speeds support latest smartphones production demand
Higher resolution cameras combined with high speeds allow for improvements in accuracy required by manufacturers of semiconductor wafer inspection and…
How Increased Smartphones Impacts Machine Vision
While smartphones are affecting available image sensor technology, there are also advances in machine vision to support the production of…
3D Measurements and Inspection: Advancing Machine Vision Cameras
The changes in PCB manufacturing with smaller chips, different packages, higher density printed circuit board, and multi-layered, and more complex…