D-5A130s/CXP

High Speed & High Resolution SWIR Sensor

The DIAMOND SWIR D-5A130 combines the excellent image quality of the high resolution and high performance Sony IMX992 SWIR image sensor with a reliable high speed CoaXPress data interface in a power efficient and compact format.

The D-5A130 offers an optimized image for in-line inspection and metrology with exact device-to-device repeatibility. If needed, the camera can be optimized to our customers’ application.

  • Sony IMX992
  • 2560 x 2048 pixels at 130 fps
  • High sensitivity of more than 75% at 1200 nm
  • Compact form factor for easy integration
  • Power optimized design
  • Easy system integration through CXP-12 interface
  • Export license required for this product

Compact outline

Low power, compact design

Device-to-device repeatability

Easy system integration

Specifications

Sensor
  • Sony IMX992
  • Optical format: 1/1.4″
  • Resolution: 2560(H) x 2048(V)
  • QE: > 75% at 1200 nm
  • Short-Wave Infra Red (SWIR)
  • InGaAs backside illuminated global shutter
Interface
  • CoaXPress – CXP 3/6/12
  • 1 or 2 lanes configurable
Framerate
  • 130 fps
Performance (typical)
  • Values will be disclosed after obtaining an Export License. For more information contact your local Teledyne Adimec office.
Functionality highlights
  • Defect pixel correction
  • Intelligent non-uniformity correction
  • Sensor binning
  • Sensitivity matching
Output resolution
  • 8, 10, or 12 bit
Image acquisiton
  • Continuous or controlled
Triggering
  • Internal CXP trigger
  • External LVDS and TTL trigger
Dimensions

Q-16A140 

Weight
  • Camera excl. lensmount: 91 g
Power
  • Input voltage: 1 x 24 Vdc PoCXP
  • Power dissipation: typical < 7 W
Operating temperature
  • Sensor temperature: +5°C  to +60°C
Compliance
  • CE
  • ROHS
Testing
  • Every camera is 100% tested on all specifications
Accessories

Standard

  • No accessories

Optional

  • Heatsink (with or without fan)
  • C-mount with SWIR coating
  • Other lensmounts available on request

APPLICATIONS

wafer-500x500
Semiconductor Wafer Inspection
Chip inspection
Semiconductor Advanced Packaging