DIAMOND SWIR SERIES

Gentific™ cameras optimized for inline inspection between 400 nm and 1700 nm wavelengths.

Teledyne Adimec’s DIAMOND SWIR camera series are designed to offer an off the shelf solution for the most challenging in-line inspection applications requiring high sensitivity above 1000 nm wavelengths. The SWIR image sensors combined with the CoaXPress interface greatly improve the accuracy and throughput of semiconductor inspection systems. Excellent image performance is guaranteed by optimal heat dissipation through the camera design and a custom calibrated non-uniformity correction, optionally combined with TEC cooling of the image sensor.

Typical applications for the DIAMOND SWIR cameras include wafer inspection, semiconductor micro crack inspection and semiconductor edge crack inspection.