D1.2 SWIR camera

DIAMOND SWIR SERIES

Gentific™ cameras optimized for inline inspection using 400 to 1700 nm wavelengths.

Teledyne Adimec’s DIAMOND SWIR camera series offer an off-the-shelf solution solution for the most demanding in-line inspection applications that require high sensitivity above 1000 nm wavelengths. The SWIR image sensors combined with the CoaXPress interface greatly improve the accuracy and throughput of semiconductor inspection systems. Superior image performance is ensured through efficient heat dissipation in the camera design and a precisely calibrated non-uniformity correction optionally combined with TEC cooling of the image sensor.

DIAMOND SWIR cameras are typically used for wafer inspection, semiconductor micro-crack inspection, and semiconductor edge crack analysis.

DIAMOND SWIR Models

CamerasMpPixel sizeResolutionMax FPSSensorSensor typeForm factorInterfaceStatus
D-1.2A1501.3 Mp10 μm1280 x 1024150 fpsSCD Cardinal 1280SWIR44.5 x 44.5 x 39 mmCoaXPress
D-5A1305 Mp3.45 μm2560 x 2048130 fpsIMX992SWIR44.5 x 44.5 x 23 mmCoaXPress
D-3A1703 Mp3.45 μm2080 x 1544170 fpsIMX993SWIR44.5 x 44.5 x 23 mmCoaXPress