As the objects to inspect/measure in high-tech manufacturing become smaller, higher-resolution cameras with better spatial resolution can improve accuracy and precision. This requires a high-quality machine vision camera design, or what is now called a metrology camera. 3D measurements in particular pose increasing demands on camera performance and reliability.
Hopefully our blog has been a source of helpful information over the last few years. Here are quick links to some of our most popular blogs this year in case you missed them. Subscribe to our blog or join the Adimec LinkedIn group to stay updated with the latest information. CCD and CMOS…
Adimec provides a sneak peak at our new OEM camera for industrial metrology that will be unveiled at the Vision Show 2014. A few hints…high resolution, high speed, CoaXPress, low power.
The great answer is yes! There have been many more CoaXPress frame grabbers made available this year.
The benefits of greater accuracy and throughput from high-resolution cameras can only be realized if the entire image sensor is usable. Metrology cameras are optimized for uniformity and dynamic range among other parameters to provide the most accurate starting image. Metrology cameras are relied on when the pixel information is used as measurement input such as…
We have talked about how high resolution, high-speed metrology cameras can improve accuracy and throughput for process control systems used in semiconductor and electronics inspection. BUT, this is only true if the cameras provide the necessary image quality and deliver this image quality consistently at the full frame rate.
This week we announced a new QUAD CoaXPress 1.1 high-speed area scan camera. This addition to the family of CMOS global shutter cameras offers highest speed, high resolution with reliable image quality to measure ever smaller critical structures or defects with the increased accuracy and throughput required by in-line optical metrology systems.
High resolution, high-speed metrology cameras can be a great way to increase accuracy and throughput of equipment even with smaller features to inspect or measure. In order to realize these benefits, the optics, the frame grabber and other components in the imaging chain must be properly matched and optimized. With increases from 4 Megapixels to…
The increasing trend from 2D measurements to 3D in semiconductor and electronics metrology and inspection systems results in more stringent requirements for the OEM camera.
The ICAF project which covered 3D single lens image capture, video over Ethernet, multi-view systems, high-speed cameras for 3D and HDTV recently announced results on their website.
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