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As the objects to inspect/measure in high-tech manufacturing become smaller, higher-resolution cameras with better spatial resolution can improve accuracy and precision. This requires a high-quality machine vision camera design, or what is now called a metrology camera. 3D measurements in particular pose increasing demands on camera performance and reliability.
Nowadays the ever-increasing demand for smartphones and tablets requires state-of-the-art production with high-speed inspection for high yield. These devices require smaller and more complex printed circuit boards (PCBs) and electronic components, resulting a need for more accurate manufacturing and measurements. This is still happening on an aggressive time scale as consumers expect new improvements quickly resulting in fast innovation cycles. Not surprisingly it is driving innovation in supporting products, including machine vision.
High-resolution cameras combined with high speeds that make full use of select image sensors provide the images required for inspection and metrology of the latest generation devices. That includes supporting the move from 2D to 3D measurements.
In addition to resolution and frame speed, there are camera parameters to consider for accurate 3D metrology. Not all of the parameters can be optimized at the same time and the most important specifications depend on the application. The increasing trend from 2D measurements to 3D results in more stringent requirements for the camera. This makes it even more important to prioritize the key specifications to avoid unnecessary costs. There are several measurement methods commonly used in semiconductor and electronics manufacturing, which provide good examples for this.
Our free ePaper discusses critical parameters, depending on the specific measurement. A few applications are described in detail to demonstrate how to determine the most important camera parameters.
Click below to download our free ePaper on Camera Requirements for 3D Metrology.
