Semiconductor back-end

Cameras for back end semiconductor packaging inspection

The principle goal of inline optical semiconductor inspection and metrology equipment is to provide 100% analysis at a high precision while maintaining high throughput. But to keep up with the innovations in packaging, the challenges to achieve this drastically increase. The fast-paced progress towards greater densities and finer dimensions are pushing the limits of vision systems. By selecting and utilizing the latest sensor technology, we design cameras that have the required resolution and speed. Driven by getting the best images out of sensors, we ensure predictable and stable equipment operation.

Based on our experience with 2D and 3D measurement methods, we design and tune our products for an exact fit into specific systems.

Throughput

Application specific sensor selection ensures higher throughput with higher accuracy.

Frame rate

To support equipment manufacturers in their challenge to gain throughput we use image sensors with high frame rates. These sensors require a design that can handle these high data rates within a critical timing tolerance to reliably produce quality images.
By our ‘design for quality’ philosophy, we make sure that these frame rates are really captured in a consistent and dependable way!

Field-of- View

Utilizing high-resolution high-speed sensors drives throughput in step-shoot-move inspection systems by both reducing scan time as well as the number of scan positions per object. Uniformity challenges increase as a larger optical field-of- view requires more complex optics and the increase of defects pixels in the sensor.
By grading the incoming sensor, dedicated processing and blemish elimination in our manufacturing process and camera operation, we deliver high resolution images with high uniformity.

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